产品描述

在线式选择性波峰焊 型号 SUNFLOW3

机体参数

General technical data

PCB 板尺寸/Max PCB size (mm) 510(L)x450(W)

最小PCB 板尺寸/Min PCB size (mm) 120(L)x50(W)

PCB 顶部间隙/PCB top side clearance (mm) 120

PCB 底部间隙/PCB bottom side clearance (mm) 30

PCB 工艺边/PCB technics side (mm) ≥3

传送带距离地面高度/Conveyor height from floor (mm) 850±25

PCB 传送速度/PCB conveyor speed (m/min) 0-12

PCB 重量/Max PCB weight (kg) ≤5

PCB 厚度(包含治具)/PCB thickness (including fixture) (mm) 1-6

传送带可调范围/Conveyor width adjustment (mm) 50-450

传送带调宽方式/Conveyor width adjustment mode 电动/Electromotion

传送带可调宽精度/Conveyor width adjusted accuracy (mm) ±0.1

PCB 传送方向/PCB Conveyor direction 左向右/Left to right

压缩空气所需压力/Compressed air required pressure (Mpa) 0.5-0.8

电源电压/Main voltage(VAC) 380

电压容差/Voltage tolerance range (%) 6-10

频率/Frequency (HZ) 50/60

功耗/Max power consumption (kw) <25

电流/Max amperage (A) <34

环境温度/Ambient temperature (℃) 10-35

机器噪音/Permanent sound level (dB) <65

通讯接口/Communication interface SMEMA

设备外形尺寸/Overall dimensions(mm) 3010(L)*1620(W)*1700(H)

设备重量/Equipment weight(kg) 2000

焊接系统

Soldering module

焊接喷嘴/Solder nozzle 高精度单喷嘴/High precision single nozzle

最小喷嘴外径/Smallest nozzle outer diameter (mm) 5.5

喷嘴内径/Nozzle inner diameter (mm) 2.5-10

波峰高度/Max solder wave height (mm) 5

锡炉容量/Solder volume (kg) 5

焊接温度/Max solder temperature (℃) 350±2

锡炉加热功率/Soldering heating power (kw) 1.3

氮气供应/Nitrogen supply 由客户提供/Offered by customer

氮气所需压力/Nitrogen required pressure (Mpa) 0.3

氮气消耗量/Nitrogen consumption (m³/h) 1.2

所需氮气纯度/Required particle cleanliness (%) ﹥99.99

预热系统

Preheating module

预热温度范围/Preheat temperature range (℃) 0-200

预热控温精度/Preheat control accuracy (℃) ±2

加热功率/Preheating medium (kw) 21

PCB 温度均匀性/PCB temperature uniformity (℃) 5

加热方式/Preheating medium 热风+红外/Hot air+Infrared

顶部预热/Top side preheating 热风/Hot air

喷雾系统

Flux module

喷雾高度/Spray height(mm) 60

喷雾速度/Control speed(mm/s) ≤400

喷嘴自动清洗功能/Spray head automatically cleaning 程序控制/Program control

助焊剂流量/Flux consumption(ml/min) 2-60

助焊剂箱体容量/Flux content(L) 2